Entry Dunbeck:1990:HMU from dectechj.bib

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BibTeX entry

@Article{Dunbeck:1990:HMU,
  author =       "P. B. Dunbeck and R. J. Dischler and J. B. McElroy and
                 F. J. Swiatowiec",
  title =        "{HDSC} and multichip unit design and manufacture",
  journal =      j-DEC-TECH-J,
  volume =       "2",
  number =       "4",
  pages =        "80--89",
  month =        "Fall",
  year =         "1990",
  CODEN =        "DTJOEL",
  ISSN =         "0898-901X",
  bibdate =      "Thu Mar 20 18:15:43 MST 1997",
  bibsource =    "http://www.math.utah.edu/pub/tex/bib/dectechj.bib",
  abstract =     "The VAX 9000 system effectively integrates
                 state-of-the-art packaging and interconnects with
                 advanced integrated circuits to achieve a short machine
                 cycle time (16 nanoseconds) and a high rate of
                 instruction execution. To meet high-frequency
                 electrical signal and pin count requirements for the
                 system, engineers chose tape automated bonding
                 technology and consequently conceived and developed the
                 high-density signal carrier (HDSC). The HDSC offers
                 densities three to five times greater than conventional
                 printed circuit boards. This unique technology is
                 manufactured using semiconductor and advanced printed
                 circuit board techniques. The HDSC is at the heart of
                 the multichip unit, a high-performance logic module,
                 with which the VAX 9000 CPUs and system control unit
                 are constructed.",
  acknowledgement = ack-nhfb,
  affiliation =  "Digital Equipment Corp., Maynard, MA, USA",
  classcodes =   "B2240 (Microassembly techniques); B0170J (Product
                 packaging); C5420 (Mainframes and minicomputers)",
  classification = "B0170J (Product packaging); B2240 (Microassembly
                 techniques); C5420 (Mainframes and minicomputers)",
  corpsource =   "Digital Equipment Corp., Maynard, MA, USA",
  keywords =     "board techniques; count requirements; DEC computers;
                 HDSC; high density signal carrier; High density signal
                 carrier; interconnects; Interconnects; lead bonding;
                 mainframes; Manufacture; manufacture; multichip;
                 Multichip unit design; packaging; Packaging; packaging;
                 pin; Pin count requirements; printed circuit; Printed
                 circuit board techniques; system control unit; System
                 control unit; tape automated bonding; Tape automated
                 bonding; unit design",
  thesaurus =    "DEC computers; Lead bonding; Mainframes; Packaging",
  treatment =    "P Practical",
}

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