Entry Bartoszek:1990:VMP from dectechj.bib
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BibTeX entry
@Article{Bartoszek:1990:VMP,
author = "John T. Bartoszek and Robert J. Hannemann and Stephen
P. Hansen and Robert J. McCarty and John C. Sweeney",
title = "{VAX 6000 Model 400} physical technology",
journal = j-DEC-TECH-J,
volume = "2",
number = "2",
pages = "52--63",
month = "Spring",
year = "1990",
CODEN = "DTJOEL",
ISSN = "0898-901X",
bibdate = "Thu Mar 20 18:15:43 MST 1997",
bibsource = "http://www.math.utah.edu/pub/tex/bib/dectechj.bib",
abstract = "The physical realization of the VAX 6000 Model 400
microprocessor design offered a number of significant
challenges at both the chip package and the module
levels. In meeting the requirements for a robust and
manufacturable midrange implementation, the VAX 6000
Model 400 physical technology approach broke new ground
for Digital, and, in some cases, for the industry. New
developments included the first tape-automated bonding
(TAB) interconnected semiconductors, extensive
board-level physical simulation, and the use of
advanced testability features on a microprocessor-based
midrange product. This paper provides details of the
physical technology used in the VAX 6000 Model 400
project to achieve system-level product goals.",
acknowledgement = ack-nhfb,
classcodes = "B1265F (Microprocessors and microcomputers); B2570D
(CMOS integrated circuits); C5130 (Microprocessor
chips); C5440 (Multiprocessor systems and techniques)",
classification = "B1265F (Microprocessors and microcomputers); B2570D
(CMOS integrated circuits); C5130 (Microprocessor
chips); C5440 (Multiprocessor systems and techniques)",
keywords = "Advanced testability features; advanced testability
features; chip package; Chip package; design; extensive
board-level; Extensive board-level physical simulation;
Interconnected semiconductors; interconnected
semiconductors; lead bonding; microprocessor;
microprocessor chips; Microprocessor design;
Microprocessor-based midrange product;
microprocessor-based midrange product; Module levels;
module levels; parallel processing; physical
simulation; tape-automated bonding; Tape-automated
bonding; VAX 6000 Model 400 physical technology",
thesaurus = "Lead bonding; Microprocessor chips; Parallel
processing",
treatment = "P Practical",
}
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6(1)54,
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6(2)62,
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6(4)63,
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7(2)34,
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2(4)13,
2(4)61,
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4(4)66,
4(4)82,
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4(4)111,
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2(1)83,
2(4)80,
3(1)58,
3(2)53,
3(2)76,
3(3)36,
4(2)51,
5(1)70,
5(3)8,
5(3)63,
5(4)36,
5(4)47,
6(2)34,
6(4)5,
7(2)34,
7(3)24,
7(4)76,
7(4)89,
8(1)46
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1(9)9,
4(3)24,
6(1)9,
6(2)22,
6(3)57,
6(4)75,
7(1)7,
7(1)23
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2(4)43,
2(4)80,
3(2)31,
4(2)25,
4(2)100
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2(3)64,
2(4)118,
3(2)31,
5(1)130,
5(2)41,
5(3)80,
6(4)50,
7(1)89,
7(1)100,
7(3)5,
7(3)84,
8(2)57
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1(9)87,
2(2)64,
2(2)73,
2(3)84,
2(4)102,
3(2)31,
3(3)1,
3(3)64,
3(3)78,
4(2)25,
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4(3)47,
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1(6)91,
1(9)29,
1(9)61,
1(9)78,
2(1)28,
2(1)73,
2(3)9,
2(3)24,
2(3)34,
2(3)64,
2(4)25,
2(4)90,
2(4)102,
2(4)130,
3(1)58,
3(1)65,
3(1)70,
3(2)10,
3(2)19,
3(2)64,
3(3)27,
3(3)36,
3(4)43,
3(4)55,
4(1)47,
4(2)25,
4(2)51,
4(2)114,
4(3)11,
4(4)66,
4(4)153,
5(1)84,
5(1)99,
5(1)107,
5(2)19,
5(2)50,
5(2)65,
5(2)77,
5(2)84,
5(2)100,
5(2)z,
5(3)53,
5(3)97,
5(4)36,
6(1)9,
6(1)66,
6(2)22,
6(3)29,
6(3)57,
6(4)5,
6(4)75,
6(4)89,
7(1)89,
7(2)5,
7(2)20,
7(2)47,
7(3)66,
7(4)5,
7(4)34,
7(4)52,
7(4)89,
7(4)101,
8(1)5,
8(1)32,
8(2)15,
8(2)32,
8(2)46,
8(2)72,
8(2)83,
8(2)96,
8(2)117
- used,
1(2)48,
1(6)91,
1(9)16,
1(9)51,
2(1)16,
2(1)49,
2(2)73,
2(2)89,
2(3)24,
2(3)44,
2(3)84,
2(4)13,
2(4)43,
2(4)102,
2(4)118,
3(1)33,
3(1)58,
3(1)79,
3(2)31,
3(3)1,
3(3)78,
4(1)68,
4(2)25,
4(2)39,
4(2)51,
4(2)73,
4(2)100,
4(2)114,
4(3)82,
4(4)137,
4(4)181,
4(4)193,
5(1)70,
5(2)100,
5(2)z,
5(3)21,
5(4)18,
5(4)36,
5(4)69,
6(2)49,
6(3)20,
6(3)44,
6(4)26,
7(1)89,
7(1)100,
7(1)136,
7(2)5,
7(4)20,
7(4)101,
8(1)46,
8(2)32,
8(2)72,
8(2)83,
8(2)96